Switched management of thermal impedence to reduce temperature e

Details Switched management of thermal impedence to reduce temperature e Switched management of thermal impedence to reduce temperature e

1996-07-15

1998-04-07

Gaffin, Jeffrey A.

Electricity: electrical systems and devices

Safety and protection of systems and devices

Circuit interruption by thermal sensing

361115, H02H 504

Patent

active

057371717

ABSTRACT:
Systems and methods for reducing the thermal stresses between an integrated circuit package and a printed circuit board, each having different thermal coefficients of expansion, to minimize thermal fatigue induced by power management cycling. The thermal impedance of the convection cooling system used with the integrated circuit package is switched with the state of the power management signal. A fan on the integrated circuit package heat sink is energized when the integrated circuit is operated in a high power mode and disabled when the integrated circuit is in a low power mode initiated by the power management system. The switching is directly responsive to the power management system and without regard to integrated circuit package temperature. The switching of the fan alters the thermal impedance to reduce the extremes of the temperature excursion and to materially reduce the rate of change of temperature experienced by the integrated circuit package. Relative temperature induced stresses on the connection between the printed circuit board and integrated circuit package are decreased.

REFERENCES:
patent: 5409352 (1995-04-01), Lin
patent: 5437327 (1995-08-01), Chiou
patent: 5457342 (1995-10-01), Herbst, II
patent: 5466969 (1995-11-01), Tsunoda
patent: 5475564 (1995-12-01), Chiou
patent: 5483102 (1996-01-01), Neal et al.
patent: 5491610 (1996-02-01), Mok et al.
patent: 5513361 (1996-04-01), Young
IBM Technical Disclosure Bulletin, vol. 20, No. 12, May 1978, "Powered Thermal Switch", p. 5096.
IBM Technical Disclosure Bulletin, vol. 38, No. 08, Aug. 1995, "Variable-Speed Cooling Assembly for a Processor Chip", pp. 613-614.
IBM Technical Disclosure Bulletin, vol. 26, No. 4, Sep. 1983, "Temperature-Sensitive Speed Control Circuit for DC Fan Motors", pp. 1832-1833.

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