Food or edible material: processes – compositions – and products – Normally noningestible chewable material or process of... – Packaged – structurally defined – or coated
Patent
1992-02-12
1993-08-17
Hunter, Jeanette
Food or edible material: processes, compositions, and products
Normally noningestible chewable material or process of...
Packaged, structurally defined, or coated
426534, 426651, 426302, A23G 330
Patent
active
052367215
ABSTRACT:
A sustained flavorant release composition is provided for use in a chewable structure. The flavorant release composition comprises a continuous film of a homogenous dispersion of a liquid flavorant agent and polyvinyl acetate, in a weight ratio of the liquid flavorant agent to polyvinyl acetate of about 1:5 to about 5:1, respectively. A method of producing the flavorant release composition is also provided and includes admixing the polyvinyl acetate, which is dissolved is a volatile, nonreactive organic solvent, with the flavorant release agent at a temperature at which the flavorant release agent does not degrade, followed by solvent removal. The chewable structure includes the continuous film of the flavorant release composition and a gum base composition.
REFERENCES:
patent: 2973273 (1961-02-01), Curtiss
patent: 3071476 (1963-01-01), Werft et al.
patent: 3795744 (1974-03-01), Ogawa et al.
patent: 3826847 (1974-07-01), Ogawa et al.
patent: 4933189 (1990-06-01), Cherukuri et al.
patent: 4992280 (1991-02-01), Yung Chu
patent: 5139798 (1992-08-01), Yatka
Robinson Joseph R.
Yung Chu Anita W.
Columbia Laboratories, Inc.
Hunter Jeanette
LandOfFree
Sustained flavorant release composition, chewable structure inco does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sustained flavorant release composition, chewable structure inco, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sustained flavorant release composition, chewable structure inco will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2242477