Suspension having an IC chip and a head slider on opposite...

Dynamic magnetic information storage or retrieval – Head mounting – Disk record

Reexamination Certificate

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Reexamination Certificate

active

06266213

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a head slider supporting device, a disk device and a suspension, and, in particular, to a magnetic head slider supporting device, a magnetic disk device and a suspension.
As a frequency of a signal which an information processing apparatus handles increases, a magnetic disk device is demanded to increase a signal writing frequency, from 70 MHz at the present time, to, for example, 200 through 300 MHz. In order to increase the signal writing frequency, it is necessary to reduce the inductance and the electrostatic capacity of a signal transmitting path from a magnetic head slider to a head IC. For this purpose, it is effective to provide the head IC near to the magnetic head slider. This is also effective to cope with a feeble recording signal obtained through reproduction by a magnetic head. On the other hand, the disk device is demanded to be thin. It is necessary that the head IC does not prevent the magnetic disk from being thin and that the head IC is loaded in a condition where the head IC does not come into contact with the magnetic disk or the like even when a shock is applied to the magnetic disk device.
2. Description of the Related Art
Magnetic disk devices, in each of which a head IC for amplifying a signal read through a head is installed on an actuator arm, are disclosed in Japanese Laid-Open Patent Application Nos.62-217476, 3-108120, 3-187295, 3-192513 and so forth.
However, in each of the above-mentioned magnetic disk devices, because the distance between the head and the head IC is long, it is difficult to reduce the inductance and the electrostatic capacity of the signal transmission path from the head to the head IC. Further, the head IC is packaged by a synthetic resin, and thereby, is thick. As a result, in some cases, in order to prevent the head IC from coming into contact with a magnetic disk or the like when a shock is applied to the magnetic disk device, it is necessary to elongate the distance between adjacent magnetic disks. As a result, the magnetic disk device is thick. Further, because the head IC is packaged by the synthetic resin, the head IC is heavy. As a result, the weight of the magnetic head slider supporting device increases. Thereby, the flying stability of the magnetic head slider above the magnetic disk is degraded, and, also, there is a possibility that, when the magnetic head slider comes into contact with a magnetic disk due to a strong shock applied to the magnetic disk device, the shock applied to the magnetic disk is so strong that the magnetic disk is damaged.
As shown in
FIG. 1
, in a head slider supporting device
1
, on the top surface
2
a
of a suspension
2
(hereinafter, the position of the suspension shown in
FIG. 1
is a reference position thereof, and ‘the top surface’ of the suspension means the top surface in this position of the suspension), wiring patterns
3
are formed from the extending end to the fixed end of the suspension
2
, and a magnetic head slider
4
is loaded on the top surface
2
a
of the suspension
2
at the extending end of the suspension
2
.
Here, provision of a head IC
5
will be considered. Due to the arrangement of the wiring patterns
3
, a surface at which the head IC is loaded is limited to the top surface
2
a
of the suspension
2
. When considering an increase of the signal writing frequency, it is preferable that the head IC
5
be provided at a position near to the magnetic head slider
4
. Therefore, it is assumed that the head IC
5
is loaded on the top surface
2
a
of the suspension
2
near the magnetic head slider
4
.
In order to prevent the head IC
5
from coming into contact with a magnetic disk
6
even when a strong shock is applied to the magnetic disk device, it is necessary that a gap
7
of the distance ‘a’ equal to or longer than 0.15 mm be provided between the head IC
5
and the magnetic disk
6
.
Recently, in order to thin the magnetic disk device, the magnetic head slider
4
of a small size (a so-called pico-slider, the height ‘b’ of which is 0.3 mm) has been used. As a result, the distance ‘c’ between the suspension
2
and the magnetic disk
6
is small.
When considering a bare head IC
5
, the bare head IC
5
is cut out from a wafer. Accordingly, the thickness of the bare head IC
5
is determined by the thickness of the wafer. At the present time, it is difficult to make the wafer thinner than 0.3 mm. Accordingly, the height (thickness) ‘d’ of the head IC is approximately 0.3 mm minimum.
Therefore, when the bare head IC
5
is simply loaded on the top surface
2
a
of the suspension
2
, it is difficult to obtain the gap equal to or longer than 0.15 mm between the head IC
5
and the magnetic disk
6
.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a head slider supporting device, a disk device and a suspension by which the above-described problem is solved.
A head slider supporting device, according to the present invention, comprises:
a suspension having a head slider loading prearranged portion on which a head slider integrally having a head is loaded, a head IC chip mounting prearranged portion on which a head IC chip is mounted, and wiring patterns which extend from the head slider loading prearranged portion via the head IC chip mounting prearranged portion;
the head slider loaded and supported on the head slider loading prearranged portion of the suspension; and
the head IC chip mounted on the head IC chip mounting prearranged portion of the suspension, wherein:
the head IC chip mounting prearranged portion includes through holes formed in the suspension, and head IC chip mounting terminals on a surface of the suspension, which surface is opposite to a surface on which the head slider loading prearranged portion is provided, the terminals being electrically connected with the extending ends of said wiring patterns via the through holes, the terminals being provided in an arrangement corresponding to terminals of the head IC chip; and
the head IC chip is mounted on the surface of the suspension, which surface is opposite to the surface on which the head slider is loaded.
Thereby, in a condition where the head slider supporting device is incorporated in a disk device, the head IC chip does not face a disk. Therefore, when a strong shock is applied to the disk device, it is possible to prevent the head IC chip from hitting the disk. Further, because the head IC chip is mounted on a portion of the suspension, it is possible that the length of each of the wiring patterns from the head slider to the head IC chip is several millimeters and thus each wiring pattern is short. As a result, the inductance of each wiring pattern is small. Further, the electrostatic capacity between each pair of adjacent wiring patterns is small. Therefore, in a case where the disk is a magnetic disk and the head slider is a magnetic head slider, it is possible to achieve a magnetic disk device which can write and read a signal of a frequency of, for example, up to 200 MHz, exceeding the 70 MHz of the present time.
The through holes may be provided in an arrangement corresponding to the terminals of the head IC chip, and the head IC chip mounting terminals may be formed at ends of the through holes.
Thereby, it is possible to achieve the head IC chip mounting prearranged portion having no wiring patterns, that is, having a wiring-pattern-less structure. Therefore, it is possible that the head IC chip mounting prearranged portion has a simple structure, and, also, has a structure such that, basically, neither inductance nor electrostatic capacity is developed. As a result, it is possible to improve reliability of mounting of the head IC chip, and, also, it is possible to bring out the characteristics of the bare head IC chip to the maximum degree.
A head slider supporting device, according to another aspect of the present invention, comprises:
a suspension having a head slider loading prearranged portion on which a head slider integrally having a head is loaded, a

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