Suspension board with circuit and producing method thereof

Details Suspension board with circuit and producing method thereof Suspension board with circuit and producing method thereof

2006-10-31

2006-10-31

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

07129418

ABSTRACT:
A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.

REFERENCES:
patent: 6388201 (2002-05-01), Yamato et al.
patent: 6841737 (2005-01-01), Komatsubara et al.
patent: 2002/0100609 (2002-08-01), Ookawa et al.
patent: 10-265572 (1998-10-01), None

Affiliated with

Also associated with

Rating

Suspension board with circuit and producing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Suspension board with circuit and producing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Suspension board with circuit and producing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3621772