Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Reexamination Certificate
2000-04-13
2003-02-11
Nguyen, Patricia T. (Department: 2817)
Amplifiers
With semiconductor amplifying device
Including distributed parameter-type coupling
C330S053000, C330S065000, C333S238000, C333S246000
Reexamination Certificate
active
06518844
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
This invention relates generally to the field of signal transmission systems, and more particularly to a suspended transmission line with an embedded amplifier.
BACKGROUND OF THE INVENTION
Microwave and radio frequency circuits are generally implemented by interconnecting amplifiers, antennas, transmitters, receivers, and other components by a series of transmission lines. The transmission lines propagate microwave and radio frequency energy between the components of the circuit.
Transmission lines are generally implemented as waveguide pipes, striplines, and/or coaxial cables. Waveguide pipes are often impractical, however, because of the difficulty of installation and the size and weight is excessive for many applications. Striplines and coaxial cables are more compact and easier to install, but use special materials and fabrication processes that lead to high transmission line cost.
Further adding to the expense of microwave and radio frequency circuits is the expense of implementing amplifiers, antennas, and other components within the circuit. Typically, each component is implemented in a specially fabricated mechanical housing such as an aluminum box having signal, digital, and power connectors. These mechanical housings must generally be designed, engineered, and machined with tight tolerances for microwave and other high frequency applications. In addition, drawing packages need to be generated and maintained for each housing. Connectors must also be thermally matched to the mechanical housing.
SUMMARY OF THE INVENTION
The present invention provides a transmission line amplifier that substantially eliminates or reduces the problems and disadvantages associated with prior methods and systems. In particular, the amplifier is embedded into a suspended transmission line for use in microwave and radio frequency applications.
In accordance with one embodiment of the present invention, a suspended transmission line with an embedded amplifier includes a support layer and a conductor supported on the support layer between first and second plates each having a ground plane. The conductor includes an input section and an output section. A propagation structure is positioned between the first and second plates to substantially contain an electric field generated by a signal transmitted on the conductor. An amplifier is coupled to the input and output sections of the conductor and is at least substantially disposed between the first and second plates. The amplifier operates to amplify an input signal received on the input section to generate an output signal on the output section.
Technical advantages of the present invention include providing a low cost and space efficient transmission system. In particular, amplifiers and other elements are embedded into the transmission line substantially without degradation in line performance. The amplifiers may be low noise and power amplifiers. Other embedded elements may be high power broadband combiners, filters, diplexers, and other passive elements as well as mixers, multipliers, switches, and other active elements. As a result, the transmission line structure is self-contained and includes fewer parts. The cost of designing, engineering, constructing, and maintaining separate mechanical housings for each element is minimized.
Another technical advantage of the present invention includes providing an improved power amplifier structure for microwave and radio frequency applications. In particular, the power amplifier is embedded within and integral with a suspended transmission line. As a result, separate substrates and carriers for the amplifier are eliminated. Separate transmission line connectors for the amplifier are also eliminated. Thus, the power amplifier may be constructed at relatively low cost.
Other technical advantages of the present invention will be readily apparent to one skilled in the art from the following figures, description, and claims.
REFERENCES:
patent: 3320556 (1967-05-01), Schneider
patent: 3419813 (1968-12-01), Kamnitsis
patent: 4214217 (1980-07-01), Saito et al.
patent: 4254386 (1981-03-01), Nemit et al.
patent: 4310814 (1982-01-01), Bowman
patent: 4394633 (1983-07-01), Klein
patent: 4614922 (1986-09-01), Bauman et al.
patent: 4647880 (1987-03-01), Argaman
patent: 4772864 (1988-09-01), Otto et al.
patent: 4916457 (1990-04-01), Foy et al.
patent: 4945319 (1990-07-01), Wilson
patent: 4958165 (1990-09-01), Axford et al.
patent: 4987377 (1991-01-01), Gray et al.
patent: 5021755 (1991-06-01), Gustafson
patent: 5030935 (1991-07-01), Williams et al.
patent: 5187490 (1993-02-01), Ohta et al.
patent: 5200719 (1993-04-01), Margulis et al.
patent: 5293175 (1994-03-01), Hemmie et al.
patent: 5444453 (1995-08-01), Lalezari
patent: 5471181 (1995-11-01), Park
patent: 5581266 (1996-12-01), Peng et al.
patent: 5712607 (1998-01-01), Dittmer et al.
patent: 5760744 (1998-06-01), Sauer
patent: 5767808 (1998-06-01), Robbins et al.
patent: 5789997 (1998-08-01), Dekker
patent: 5872545 (1999-02-01), Rammos
patent: 5914695 (1999-06-01), Liu et al.
patent: 5946794 (1999-09-01), Koizumi et al.
patent: 6081988 (2000-07-01), Pluymers et al.
patent: 2002/0044098 (2002-04-01), Von Stein et al.
patent: 0 317 414 (1989-05-01), None
patent: 0 508 662 (1992-10-01), None
patent: 0 801 433 (1997-10-01), None
patent: S63-281502 (1988-11-01), None
patent: 63281502 (1988-11-01), None
International Search Report dated Aug. 6, 2001, for PCT/US 01/11202 filed Apr. 6, 2001.
Peter, R., et al, “High-Performance HEMT Amplifiers with a Simple Low-Loss Matching Network,” IEEE Transactions on Microwave Theory and Techniques, vol. 39, Sep. 1, 1991, No. 9, New York, US, pp. 1673-1675.
PCT International Search Report Dated Aug. 8, 2001 for PCT/US01/11277 Filed Apr. 6, 2001.
Mosko, United States Statutory Invention Registration H27, “Integrable Broadside Power Divider,” filed Sep. 3, 1985, published Feb. 4, 1986.
M. Saito, et al, XP-002172854, “UHF TV Tuner Using PC Board with Suspended Striplines,” IEEE Transactions on Consumer Electronics, vol. CE-24, No. 4, Nov. 1978, pp. 553-559.
PCT International Search Report dated Aug. 6, 2001 for PCT/US01/11410 filed Apr. 6, 2001.
PCT US01/11410 to Raytheon Company, publication date Oct. 25, 2001.
Pozar, D.M.,Microwave Engineering, John Wiley & Sons, Inc., Second Edition, pp. 363-368, 1998.
Wilkinson, E.J., “An N-Way Hybrid Power Divider,” IRE Transactions on Microwave Theory and Techniques, vol. MTT-8, No. 1, pp. 116-118, Jan., 1960.
Saleh, A.A.M., “Planar Electrically Symmetric n-Way Hybrid Power Dividers/Combiners,” IEEE Transactions on Microwave Theory and Techniques, vol. MTT-28, No. 6, pp. 555-563, Jun., 1980.
Green, H.E., “The Numerical Solution of Some Important Transmission-Line Problems,” IEEE Transactions on Microwave Theory and Technqiues, vol. MTT-13, No. 5, pp. 676-692, Sep., 1965.
Fromm, W.E., “Characteristics and Some Applications of Stripline Components,” IEEE Transactions on Microwave Theory and Techniques, vol. MTT-3, No. 2, pp. 13-19, Mar., 1955.
Saleh, A.A.M., Computation of the Frequency Response of a Class of Symmetric N-Way Power Dividers, Bell System Technical Journal, vol. 59, No. 8, pp. 1493-1512, Oct., 1980.
Sherman James R.
Von Stein Ofira M.
Baker & Botts L.L.P.
Nguyen Patricia T.
Raytheon Company
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