Surround print process for the manufacture of electrode embedded

Details Surround print process for the manufacture of electrode embedded Surround print process for the manufacture of electrode embedded

1994-03-07

1996-07-09

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4271265, 427278, 427365, 4273762, 4274192, B05D 512

Patent

active

055342906

ABSTRACT:
A multilayered ceramic chip capacitor. An electrode ink pattern is formed on a release film. The electrode ink pattern is calendered, densified and flattened. Dielectric material is applied to the release film and surrounds but does not cover the electrode ink to form an electrode surround printed dielectric sheet. The dielectric is calendered, densified and flattened. The densities of the electrode ink and dielectric are formulated such that after calendering the electrode ink and dielectric surfaces are substantially coplanar. A final overcoat of dielectric is applied over the surround printed dielectric sheet.

REFERENCES:
patent: 4692285 (1987-09-01), Bloomfield et al.
patent: 5101319 (1992-03-01), Piffexes et al.
patent: 5194335 (1993-03-01), Effenberger et al.
patent: 5292548 (1994-03-01), Rainwater
patent: 5370759 (1994-12-01), Hakotani et al.

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