1990-02-26
1992-01-21
Larkins, William D.
357 14, 357 37, 357 39, 357 64, 357 86, H01L 2974, H01L 2990, H01L 2948
Patent
active
050831852
ABSTRACT:
A surge absorption device includes fundamentally a first semiconductor region, a second semiconductor region forming a pn junction between itself and the first region, a third region determining the effective thickness of the second region, and a fourth region provided in contact with the first region and forming an injection junction for causing first minority carriers of a kind the same as that of minority carriers in the first region to be injected into the first region. When a depletion layer formed by application of reverse bias across the pn junction reaches the third region, a punch-through region is formed in the second region. In this state, when minority carriers are injected from the fourth region into the first region, the minority carriers are absorbed by the second region to constitute the device current.
REFERENCES:
patent: 3302076 (1967-01-01), Kang
patent: 3328584 (1967-06-01), Weinstein
patent: 3335296 (1967-08-01), Smart
patent: 3427512 (1969-02-01), Mapother
patent: 3566213 (1971-02-01), Kaiser
patent: 4063277 (1977-12-01), Gooen
patent: 4115798 (1978-09-01), Platzoeder
patent: 4631561 (1986-12-01), Foroni et al.
Sze, Physics of Semiconductor Devices, (Wiley, N.Y., 1981), pp. 613-619.
Thyristor-Electronics (1), Thyristor Device, by Editorial Committee, (1973, Maru-Zen K.K., Tokyo, publ.).
Hasegawa Teiji
Hayashi Yutaka
Muramatsu Yuji
Sato Masa-aki
Yoshihara Hirofumi
Agency of Industrial Science & Technology, Ministry of Internati
Larkins William D.
Mitaka Denshi Kagaku Laboratory Inc.
Sankosha Corporation
LandOfFree
Surge absorption device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surge absorption device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surge absorption device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-119018