Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate
Reexamination Certificate
2007-04-10
2007-04-10
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
Clay, silica, or silicate
C106S003000, C438S692000, C438S693000
Reexamination Certificate
active
10611233
ABSTRACT:
Slurries and methods for the chemical mechanical polishing of high density copper interconnects in a low k ILD are presented. In a particular embodiment of the present invention, a slurry for polishing copper is formed by combining a surfactant comprising an alkyl ethoxy organic acid such as glycolic acid ethoxylate lauryl ether (GAELE), an abrasive such as silica, an oxidizing agent such as hydrogen peroxide, and a chelating buffer system such as citric acid and potassium citrate dissolved in the mixture. This slurry provides a very low incidence of bent line defects, a low erosion rate, and a low dishing rate on a substrate comprising high density copper interconnects in a low k ILD. Embodiments of methods of the present invention use the disclosed slurries.
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Miller Anne E.
Poutasse Charles
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Marcheschi Michael
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