Surface wave termination for saw device

Details Surface wave termination for saw device Surface wave termination for saw device

1977-02-23

1978-06-20

Smith, Alfred E.

Wave transmission lines and networks

Coupling networks

With impedance matching

310313, 333 72, H03H 906, H03H 926, H03H 930, H03H 932

Patent

active

040964558

ABSTRACT:
A two stage surface wave termination for a surface acoustic wave device, such as a filter or delay line. The termination includes a wafer of an acoustically lossy, relatively hard polymeric material that is bonded to the surface of the SAW device's piezoelectric substrate between an end of the substrate and an interdigitated transducer provided thereon. A band of an elastomeric material is bonded to the substrate along the edge of the wafer nearest the transducer.

REFERENCES:
patent: 4047130 (1977-09-01), Lim et al.

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