Surface wave filter having photoresist damping material thereon

Wave transmission lines and networks – Coupling networks – Electromechanical filter

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333151, 310313R, 310326, 29 2535, H03H 9145, H03H 925

Patent

active

046045945

ABSTRACT:
A surface wave filter with a wafer-shaped substrate formed of monocrystalline piezoelectric material having a surface, input and output transducers disposed on the surface of the substrate, a coupler for coupling the transducers being spaced apart from the transducers on the surface of the substrate defining zones therebetween, and electric conductor runs being connected to the transducers on the surface of the substrate and having ends, includes a damping layer formed of photoresist material with a plastic base covering substantially the entire surface of the substrate except for a region bounded by the transducers, the coupler, the ends of the electric conductor runs and the zones between the transducers and the coupler, and a method for manufacturing the filter.

REFERENCES:
patent: 4139791 (1979-02-01), Yamada et al.
patent: 4354129 (1982-10-01), Ieki
patent: 4426595 (1984-01-01), Kawaura et al.
patent: 4470026 (1984-09-01), Buckinx et al.
patent: 4486724 (1984-12-01), Schofield
patent: 4511866 (1985-04-01), Milsom
Anderson, A. C., et al.; "Attenuating Thin Films for SAW Devices"; 1980 Ultrasonics Symposium Proceedings; Boston, Mass., Nov. 5-7, 1980.

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