Surface treatment process for enhancing a release rate of...

Details Surface treatment process for enhancing a release rate of... Surface treatment process for enhancing a release rate of...

2006-10-10

2006-10-10

Bell, Bruce F. (Department: 1746)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S350000, C204S284000, C204S292000, C427S098800, C427S243000, C427S247000

Reexamination Certificate

active

07118665

ABSTRACT:
The present invention discloses a surface treatment process for enhancing both the release rate of metal ions from a sacrificial electrode, and the working life of the electrode. A high density of micro pores are formed on the surface of the sacrificial electrode. Chlorine ions are then implanted into the pores. The chlorine ions prevent a passive film from forming on the sacrificial electrode during use, in which an electric current flows through the sacrificial electrode.

REFERENCES:
patent: 4040863 (1977-08-01), Kitamura
patent: 2002/0056702 (2002-05-01), Bishop et al.

Affiliated with

Also associated with

Rating

Surface treatment process for enhancing a release rate of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface treatment process for enhancing a release rate of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface treatment process for enhancing a release rate of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3621683