Surface treatment process for copper foil

Details Surface treatment process for copper foil Surface treatment process for copper foil

1976-09-28

1978-04-04

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

204 37T, C25D 100

Patent

active

040825914

ABSTRACT:
A process is disclosed for preventing oxidative coloring while maintaining good solderability of copper foil wherein a thin layer of tin or a combination of tin and zinc alloy is electro-deposited on the surface of the shiny side of copper foil and the tin or binary alloy diffuses into the surface portion of electrodeposited copper foil by heating, such as drying, baking or lamination under heat and pressure. By virtue of an extremely thin layer of the tin alloy thus formed, the bright tone of the copper surface is maintained during storage or during subsequent lamination of the foil, and the solderability thereof is also improved.

REFERENCES:
patent: 2159510 (1969-05-01), Pavlish et al.
patent: 2894885 (1959-07-01), Gray
patent: 2900314 (1959-08-01), Saubestre
patent: 3072499 (1963-01-01), Cole
patent: 3290170 (1966-12-01), Houston
patent: 3528892 (1970-09-01), Mazur
patent: 3728177 (1973-04-01), Caule

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