Surface treatment of semiconductor substrates

Details Surface treatment of semiconductor substrates Surface treatment of semiconductor substrates

1976-03-25

1977-09-27

Kellogg, Arthur D.

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 28, C03C 2300

Patent

active

040509540

ABSTRACT:
The invention comprehends establishing a hydrophilic surface on polished semiconductor wafers, such as silicon, after polishing (e.g. silica polishing) by oxidation and hydrolysis of the wafer surface for conditioning thereof for post-polishing cleaning.

REFERENCES:
patent: 2690383 (1954-09-01), Bradshaw
J. Electrochem. Soc., Solid-State Science & Technology, vol. 120, No. 9, Sept. 1973 - "Silicon Surface Contamination: Polishing and Cleaning", R. L. Meek et al., pp. 1241-1246.
Solid State Technology, Nov. 1975, "LSI Wafer Cleaning Techniques", D. Tolliver, pp. 33-36.
Russian - Journal of Applied Chemistry, 31-11833 (1958) pp. 1183-1190, "Influence of the pH of the Medium and the Temperature on the Proportions of Active Oxidizing Agents in Hypochlorite Solutions in Chlorination and Bleaching Processes" by I. E. Flis.

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