Metal treatment – Process of modifying or maintaining internal physical... – Processes of coating utilizing a reactive composition which...
Patent
1996-12-17
2000-10-10
Phipps, Margery
Metal treatment
Process of modifying or maintaining internal physical...
Processes of coating utilizing a reactive composition which...
148286, 148712, 4284721, 429 59, 429101, 420900, C23C 816
Patent
active
061297895
ABSTRACT:
Steam is contacted with a hydrogen absorbing alloy in a temperature range from 200.degree. C. to 400.degree. C. With a contact catalytic reaction of water, a metal contained in the hydrogen absorbing alloy is changed to an oxide or a hydroxide. Hydrogen produced causes the Ni compound to be reduced and thereby the Ni metal that is catalytically active is produced. Thus, the surface of the hydrogen absorbing alloy is activated. The steam is contained in an inert gas or a reductive gas. This treatment method is suitable as an activation treatment for a hydrogen absorbing alloy used as an active material of a negative electrode of a secondary battery.
REFERENCES:
patent: 2827405 (1958-03-01), Evans et al.
patent: 3556870 (1971-01-01), Debray et al.
patent: 5211921 (1993-05-01), Sommers et al.
patent: 5328524 (1994-07-01), Hertz
patent: 5499279 (1996-03-01), Chakvaborty
Abstract of Japanese Patent No. 3-289047, patent issued Dec. 19, 1991.
Abstract of Japanese Patent No. 4-137361, patent issued May 12, 1992.
Abstract of Japanese Patent No. 5-13077, patent issued Jan. 22, 1993.
Abe Katsushi
Itoh Kazuhiko
Kawase Hiroshi
Morishita Shinya
Ohya Yutaka
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
Phipps Margery
LandOfFree
Surface treatment method of hydrogen absorbing alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface treatment method of hydrogen absorbing alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface treatment method of hydrogen absorbing alloy will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2253498