Surface treatment method of copperfoil

Details Surface treatment method of copperfoil Surface treatment method of copperfoil

1976-06-16

1977-09-20

Whitby, Edward G.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

428647, 428658, 204432, 428209, 428901, C25D 322, C25D 330

Patent

active

040494810

ABSTRACT:
The present invention relates to a method of treatment on the surface of copperfoil mainly used for printed circuits. More particularly, it relates to a method of electrodeposition of a binary alloy consisting of zinc and tin as a barrier layer against copper migration into an adhesive substrate during subsequent heat press lamination, while a binary alloy on copperfoil is converted to ternary alloy defusing into copper by heat press lamination resulting in a layer of Cu-Zn-Sn, ternary alloy. This layer prevents spottings on the etched surfaces and provides high resistance to hydrochloric acid, and better adhesion than hitherto used alloys.

REFERENCES:
patent: 1904732 (1933-04-01), Haueisen et al.
patent: 2900314 (1959-08-01), Saubestre
patent: 3314771 (1967-04-01), Hoffmann et al.
patent: 3585010 (1971-06-01), Luce et al.
patent: 3857681 (1974-12-01), Yates et al.

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