Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating substrate prior to coating
Reexamination Certificate
2005-04-12
2005-04-12
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating substrate prior to coating
C205S194000, C148S240000
Reexamination Certificate
active
06878261
ABSTRACT:
A surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards is provided. The method includes nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon, and coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.
REFERENCES:
patent: 3293109 (1966-12-01), Luce et al.
patent: 4469567 (1984-09-01), Torday et al.
patent: 549-108808 (1976-03-01), None
patent: 5-171458 (1993-07-01), None
patent: 101980000492 (1983-11-01), None
patent: 1019810001120 (1984-10-01), None
patent: 1019840006731 (1987-04-01), None
Choi Chang-Hee
Kang Byoung-Un
Kim Sang-Kyum
Cantor & Colburn LLP
LG Cable Ltd.
Wong Edna
LandOfFree
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