Surface treatment method for solder joint

Details Surface treatment method for solder joint Surface treatment method for solder joint

2007-08-15

2010-06-15

King, Roy (Department: 1793)

Metal treatment

Process of modifying or maintaining internal physical...

Processes of coating utilizing a reactive composition which...

C148S240000, C148S243000, C148S284000, C106S014050, C106S014110, C106S014210

Reexamination Certificate

active

07736445

ABSTRACT:
A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.

REFERENCES:
patent: 57-134294 (1982-08-01), None

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