Surface treatment method and apparatus thereof

Coating processes – Immersion or partial immersion

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118425, 118429, 118698, 134 57R, 134 60, 137256, B05D 118

Patent

active

048308889

ABSTRACT:
Treatment baths for surface treatment of semiconductor wafers by dipping thereof into a treatment liquid are arranged in a treatment bath train.
One or more selected treatment baths among these treatment baths are constructed to have a plurality of unit treatment vessels. The treatment liquid in these treatment vessels is replaced successively one by one of the unit treatment vessels. The semiconductor wafers are dipped in the treatment liquid contained in that unit treatment vessel that is not being subjected at that moment to the replacement of the treatment liquid.

REFERENCES:
patent: 2386079 (1945-10-01), Weiskopf
patent: 3165108 (1965-01-01), Elliott et al.
patent: 3641906 (1972-02-01), Orr et al.
patent: 3969074 (1976-07-01), Chung
patent: 3986518 (1976-10-01), Sato
patent: 4374681 (1983-02-01), Schueneman
patent: 4377986 (1983-03-01), Juve
patent: 4406248 (1983-09-01), Araki et al.
patent: 4568576 (1986-02-01), Minnie, Jr. et al.
Nakamura, Masakatsu et al, "Overall Technology Review for Automation Systems for Modern Semiconductor Plants", Science Forum Company, Ltd., (1984) pp. 62-68.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Surface treatment method and apparatus thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface treatment method and apparatus thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface treatment method and apparatus thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2321497

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.