Surface treatment method and apparatus thereof

Details Surface treatment method and apparatus thereof Surface treatment method and apparatus thereof

1986-09-09

1989-05-16

Beck, Shrive

Coating processes

Immersion or partial immersion

118425, 118429, 118698, 134 57R, 134 60, 137256, B05D 118

Patent

active

048308889

ABSTRACT:
Treatment baths for surface treatment of semiconductor wafers by dipping thereof into a treatment liquid are arranged in a treatment bath train.
One or more selected treatment baths among these treatment baths are constructed to have a plurality of unit treatment vessels. The treatment liquid in these treatment vessels is replaced successively one by one of the unit treatment vessels. The semiconductor wafers are dipped in the treatment liquid contained in that unit treatment vessel that is not being subjected at that moment to the replacement of the treatment liquid.

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patent: 4568576 (1986-02-01), Minnie, Jr. et al.
Nakamura, Masakatsu et al, "Overall Technology Review for Automation Systems for Modern Semiconductor Plants", Science Forum Company, Ltd., (1984) pp. 62-68.

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