Surface treatment method and apparatus therefor

Details Surface treatment method and apparatus therefor Surface treatment method and apparatus therefor

1988-08-04

1990-01-09

Beck, Shrive

Coating processes

Immersion or partial immersion

118429, 134 57R, 134 60, B05D 118

Patent

active

048927619

ABSTRACT:
Time periods required for dipping semiconductor wafers in a treatment liquid in a treatment bath and for replacing the treatment liquid etc. are previously stored in a memory. Based on these data, the expected clock time when the semiconductor wafers reach each treatment bath is calculated and the replacement of the treatment liquid and transporation of the wafers are controlled on the basis of these data and the expected clock time.

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Masakatsu Natamura and Mitsuo Ai (editors); "Overall Technology Review for Automation Systems for Modern Semiconductor Plants"; published by Science Forum Co., Ltd.; Jul. 25, 1984; pp. 62-68, with english translation.

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