Surface treatment method and apparatus for a semiconductor wafer

Details Surface treatment method and apparatus for a semiconductor wafer Surface treatment method and apparatus for a semiconductor wafer

1991-06-14

1993-11-09

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

134155, 134902, B08B 304

Patent

active

052594076

ABSTRACT:
A wafer surface treatment apparatus and method used in the apparatus including a treatment tank with a cylindrical inside with a bottom, a circular recess formed in the bottom of the tank, a plurality of lower fluid holes opened in the recess, and a horizontally long opening provided at lower part of the side wall of the tank. A movable wall is tightly but slidably installed in the cylindrical inside of the tank so that the movable wall forms a closed room with the recess when it comes into contact with the bottom of the tank. Also, a plurality of upper fluid holes are provided so as to communicate with the closed room, and a rinsing water and washing liquid supply/discharge device is connected to the upper and lower fluid holes. Surfaces of a semiconductor wafer is treated by placing one wafer in the recess, closing the opening, and then spouting a fluid (washing liquid and rinsing water) onto the both sides of the wafer repeatedly while the wafer is floating and rotated by a spouting force of the fluid in the closed room. The fluid used in the treatment is discharged from the tank while the treatment is being performed.

REFERENCES:
patent: 4736758 (1988-04-01), Kusuhara
patent: 4777970 (1988-10-01), Kusuhara
patent: 4922277 (1990-05-01), Carlson
patent: 5169408 (1992-12-01), Biggerstaff et al.

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