Abrading – Abrading process – Combined abrading
Reexamination Certificate
2007-03-19
2010-10-19
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
Combined abrading
C451S041000, C451S054000, C451S059000, C451S066000, C451S303000, C451S307000
Reexamination Certificate
active
07815492
ABSTRACT:
A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.
REFERENCES:
patent: 5209027 (1993-05-01), Ishida et al.
patent: 5749769 (1998-05-01), Church et al.
patent: 6179689 (2001-01-01), Ohno et al.
patent: 6971946 (2005-12-01), Suzuki
patent: 2001/0029158 (2001-10-01), Sasaki et al.
patent: 2003/0190865 (2003-10-01), Somekh
patent: 2005/0048880 (2005-03-01), Tolles et al.
patent: 58153220 (1983-09-01), None
patent: 5-190654 (1993-07-01), None
Aoto Tadashi
Higuma Masakazu
Kikuchi Eiichiro
Sasaki Yasuharu
Morgan Eileen P.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tokyo Electron Limited
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