Surface treatment for bonding pad

Details Surface treatment for bonding pad Surface treatment for bonding pad

1999-02-01

2000-05-16

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 26, 438115, 438906, H01L 2100, C23F 100

Patent

active

060632070

ABSTRACT:
A surface treatment method for bonding pad is described, in which a passivation layer is formed on a bonding pad and an opening is formed within the passivation by a plasma etching process. The bonding pad is corroded by the etching plasma containing fluorine during the etching process. The bonding pad is rinsed with deionized water comprising carbon dioxide to reduce the effects of the corrosion phenomenon.

REFERENCES:
patent: 5336371 (1994-08-01), Chung et al.
patent: 5434104 (1995-07-01), Cain et al.
patent: 5470393 (1995-11-01), Fukazawa
patent: 5635053 (1997-06-01), Aoki et al.
patent: 5766368 (1998-06-01), Bowers
patent: 5824234 (1998-10-01), Jou et al.
patent: 5849639 (1998-12-01), Molloy et al.
patent: 5883650 (1999-03-01), Figueredo et al.
patent: 5936296 (1999-08-01), Park et al.

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