Surface treating process for copper foil for use in printed circ

Details Surface treating process for copper foil for use in printed circ Surface treating process for copper foil for use in printed circ

1977-06-03

1978-12-26

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

204 35R, 204 40, 204 44, 204 56R, 156151, C25D 706, C25D 548, C25D 510

Patent

active

041315170

ABSTRACT:
A surface treating process for a copper foil for use in a printed circuit, in which the surface of a copper foil is subjected to a cathodic treatment in an electrolytic bath of an aqueous solution of sulfuric acid, containing nickel and copper ions, with the copper foil being used as a cathode.
The copper foil thus subjected to cathodic treatment is brought into contact with an aqueous solution containing one of sodium hexametaphosphate .alpha.-nitroso R salt, 2-mercaptobenzothiazole, rubeanic acid, anthranilic acid, benzenesulfonamide, phthalic acid, potassium dichromate.

REFERENCES:
patent: 1750092 (1930-03-01), Crawford et al.
patent: 3247082 (1966-04-01), DuRose
patent: 3585010 (1971-06-01), Luce et al.

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