Surface treating cleaning method

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 26, B08B 300, B08B 305, C23G 100

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active

052903613

ABSTRACT:
A combination of a first surface treating solution comprising an inorganic or organic alkali such as ammonia or a quaternary ammonium hydroxide, hydrogen peroxide, water and a second surface treating solution of ultra-pure water, at least one of the first and second surface treating solutions containing as a complexing agent a compound having one or more phosphonic acid groups in the molecule and showing chelating ability, or an oxidized form thereof, or polyphosphoric acid or a salt thereof, is effective for making semiconductor surfaces free from harmful metallic impurities such as Fe, Al, Zn, etc.

REFERENCES:
patent: 4059678 (1977-11-01), Winkley
patent: 4239661 (1980-12-01), Muraoka et al.
patent: 4304762 (1981-12-01), Leigh
patent: 4339340 (1982-07-01), Murraoka et al.
patent: 4362706 (1982-12-01), Willard
patent: 4534945 (1985-08-01), Hopkins et al.
Chemical Abstract 70 (1969), 107901s.
Chemical Abstract 84 (1976) 188550r.
Database WPI, week 7808, JP-A-50 147 284, Nov. 26, 1975.
Database WPI, week 7630, JP-A-50 022 721, Mar. 11, 1975.

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