Metal treatment – Compositions – Fluxing
Patent
1993-08-31
1994-09-20
Rosenberg, Peter D.
Metal treatment
Compositions
Fluxing
228223, B23K 3534
Patent
active
053485904
ABSTRACT:
A preflux for a printed circuit board is provided, and the preflux has an excellent heat resistance adapted to a method of surface mounting electronic parts on the printed circuit board, and it is highly operable and reliable. The preflux is comprised mainly of a 2-alkylbenzimidazole derivative having the general formula of ##STR1## wherein R.sup.1 and R.sup.2 may be identical with or different from each other and are hydrogen atom, a lower alkyl group or a halogen atom, and R.sup.3 is an alkyl group of three or more carbon atoms, and contains a chelating agent reacting with copper ions added thereto. Addition of a proper amount of the chelating agent to the preflux makes it easy to form a highly heat-resistant film of the preflux only on copper or copper alloy patterns without masking the printed contacts and joint land. The chelating agent reacts with copper ions and selected from the group consisting of ethylene diamine triacetic acid, diethylene triamine pentaacetic acid, nitrylotriacetic acid, iminodiacetic acid, 1,2-cyclohexanediamine tetraacetic acid and glycolether diamine tetraacetic acid.
REFERENCES:
patent: 5127571 (1992-07-01), Gutierrez
patent: 5176749 (1993-01-01), Costello
Oka Hitoshi
Shigemura Seizi
Shindo Motokazu
Hitachi , Ltd.
Hitachi Computer Electronics
Rosenberg Peter D.
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