Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate
2005-11-29
2005-11-29
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
C428S612000, C428S648000, C428S658000, C428S674000, C428S935000
Reexamination Certificate
active
06969557
ABSTRACT:
The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surface-treated copper foil for a low-dielectric substrate which is used in bonded relationship to a low-dielectric substrate, which is characterized in that a nodular-treated layer constituted by bump-like copper particles is formed on a surface of the copper foil and that ultrafine copper particles are caused to precipitate on the whole surface of the nodular-treated layer and adhere thereto and the roughness value Rz of the surface is 1.0 to 6.5 μm. The surface color of the surface-treated copper foil has L* of not more than 50, a* of not more than 20 and b* of not more than 15. A passivated layer containing at least one kind selected from the group consisting of zinc and nickel is provided on surfaces of the ultrafine copper particles which are caused to precipitate on the whole of the surfaces of the bump-like copper particles of the nodular-treated layer and adhere thereto.
REFERENCES:
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5389446 (1995-02-01), Yamanishi et al.
patent: 5622782 (1997-04-01), Poutasse et al.
patent: 5861076 (1999-01-01), Adlam et al.
patent: 6605369 (2003-08-01), Takahashi et al.
patent: 5-29740 (1993-02-01), None
patent: 06-256966 (1994-09-01), None
patent: 11-340596 (1999-12-01), None
patent: 11-354901 (1999-12-01), None
patent: WO 01/45475 (2001-05-01), None
patent: WO 01/56342 (2001-08-01), None
patent: WO 01/56343 (2001-08-01), None
patent: WO 01/56344 (2001-08-01), None
patent: WO 01/56345 (2001-08-01), None
patent: WO 03/015483 (2003-02-01), None
Kataoka Takashi
Matsuda Mitsuyoshi
Lam Cathy F.
Mitsui Mining & Smelting Co. Ltd.
Rothwell Figg Ernst & Manbeck P.C.
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