Surface roughening method for light emitting diode substrate

Details Surface roughening method for light emitting diode substrate Surface roughening method for light emitting diode substrate

2011-03-08

2011-03-08

Cao, Phat X (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C257S094000, C257SE33074

Reexamination Certificate

active

07901963

ABSTRACT:
The present invention discloses a surface roughening method for an LED substrate, which uses a grinding technology and an abrasive paper of from No. 300 to No. 6000 to grind the surface of a substrate to form a plurality of irregular concave zones and convex zones on the surface of the substrate. Next, a semiconductor light emitting structure is formed on the surface of the substrate. The concave zones and convex zones can scatter and diffract the light inside LED, reduce the horizontally-propagating light between the substrate and the semiconductor layer, decrease the probability of total reflection and promote LED light extraction efficiency.

REFERENCES:
patent: 6018379 (2000-01-01), Mizobata et al.
patent: 6870193 (2005-03-01), Takeya et al.
patent: 2003/0214718 (2003-11-01), Kaminsky et al.
patent: 2007/0297729 (2007-12-01), Kodama et al.

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