Surface protection material for printed circuit board and proces

Details Surface protection material for printed circuit board and proces Surface protection material for printed circuit board and proces

1995-06-07

1997-08-19

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427345, 4273722, 427384, 427409, 205196, B05D 512

Patent

active

056586116

ABSTRACT:
The surface protection material for printed circuit boards disclosed is one in which a compound having a benzimidazole derivative as an effective component is adjusted to pH range from 1 to 5 with a salt-forming acid and which is an aqueous solution whose metal content of such a heavy metal as copper, manganese and zinc is not higher than 50 ppm. A copper or copper alloy circuit section surface is brought into contact with the surface protection material aqueous solution, and by using an ion exchange resin or by electrolysis, ions of the heavy metal dissolved out of the circuit section surface due to the contact thereof with the surface protection material aqueous solution are removed. The concentration of the heavy metal in the surface protection material aqueous solution is held within 50 ppm. A surface protection film is formed only on the element mounting pad without being formed on a gold plating layer on a terminal, and this enhances the contact reliability of circuits.

REFERENCES:
patent: 3791431 (1974-02-01), Steinbrecher et al.
patent: 3839097 (1974-10-01), Hall et al.
patent: 4303704 (1981-12-01), Courduvelis et al.
patent: 5435860 (1995-07-01), Maki et al.

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