Surface protecting adhesive film for semiconductor wafer and...

Details Surface protecting adhesive film for semiconductor wafer and... Surface protecting adhesive film for semiconductor wafer and...

2005-04-12

2005-04-12

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S678000, C438S118000

Reexamination Certificate

active

06879026

ABSTRACT:
An adhesive film for protecting the surface of a semiconductor wafer wherein the adhesive layer is formed on one surface of a substrate film, the substrate film comprising at least one layer which satisfies the following requisites (A) and at least one of (B) or (C):requisite (A): high elastic modulus properties in which the storage modulus is 1×109Pa to 1×1010Pa under the total temperature range of from 18 to 50° C.requisite (B): high elastic modulus properties in which the storage modulus within at least part of the temperature range of from 50 to 90° C. is not more than 1×108Pa.requisite (C): high elastic modulus properties with expansibility by water absorption in which the size-changing ratio by absorbing water for four hours is 0.05 to 0.5% at 23° C. and 90% RH.

REFERENCES:
patent: 2000-150432 (2000-05-01), None
patent: 2000-212524 (2000-08-01), None

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