Surface polishing pad

Details Surface polishing pad Surface polishing pad

1998-11-18

2000-07-18

Rose, Robert A.

Abrading

Flexible-member tool, per se

Laminate

451921, B24D 1700

Patent

active

060899662

ABSTRACT:
The present invention provides a polishing pad having a double-layer structure that allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighborhood of its outer circumference.
A polishing pad consists of a hard upper-layer member 11 having a lower compression rate and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, and an adhesive layer 13 interposed between both members to adhere them together, wherein a plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm or less and that groove depth is at least half or more the thickness of the upper-layer member.

REFERENCES:
patent: 3609925 (1971-10-01), Comella-Riera
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5564965 (1996-10-01), Tanaka et al.
patent: 5876269 (1999-03-01), Torii

Affiliated with

Also associated with

Rating

Surface polishing pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface polishing pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface polishing pad will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2031036