Surface passivation process of compound semiconductor material u

Details Surface passivation process of compound semiconductor material u Surface passivation process of compound semiconductor material u

1994-06-21

1995-09-19

Fourson, George

Fishing, trapping, and vermin destroying

437946, H01L 2126

Patent

active

054515424

ABSTRACT:
A method for passivating compound semiconductor surfaces by photolytically disrupting molecular sulfur vapor with ultraviolet radiation to form reactive sulfur which then reacts with and passivates the surface of compound semiconductors.

REFERENCES:
patent: 4273594 (1981-06-01), Heller et al.
patent: 4685976 (1987-08-01), Schachmeyer et al.
patent: 4877757 (1989-10-01), York et al.
Yablonovitch, et al., Nearly Ideal Electronic Properties of Sulfide Coated GaAs Surfaces; Appl. Phys. Lett. 51(6), 10 Aug. 1987, pp. 439-441.
Tiedje, et al., Ultraviolet Photoemission Studies of GaAs (100) Surfaces Chemically Stabilized by H.sub.2 S Treatments; J. Vac. Sci. Technol. B7(4), Jul./Aug. 1989, pp. 837-840.
Wang, Surface Passivation of GaAs with P.sub.2 S.sub.5 -Containing Solutions; J. Appl. Phys. 71 (6), 15 Mar. 1992, pp. 2746-2756.
"Ultraviolet Photosulfidation of III-V Compound Semiconductors for Electronic Passivation", K. R. Zavadil, et al., American Vacuum Society--40th National Symposium--Nov. 15-19, 1993.
"Ultraviolet Photosulfidation of III-V Compound Semiconductors: A New Approach to Surface Passivation", C. I. H. Ashby, et al., Appl. Phys. Lett. 64(18), 2 May 1994, pp. 2388-2390.

Affiliated with

Also associated with

Rating

Surface passivation process of compound semiconductor material u does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface passivation process of compound semiconductor material u, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface passivation process of compound semiconductor material u will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1827924