Surface package type semiconductor package and method of produci

Details Surface package type semiconductor package and method of produci Surface package type semiconductor package and method of produci

1994-06-23

1997-03-04

Fidei, David T.

Special receptacle or package

Holder for a removable electrical component

Including electrical field, magnetic field, or static...

206718, 206204, 2064591, B65D 7302

Patent

active

056070594

ABSTRACT:
In surface packaging of thin resin packages such as resin molded memory ICs cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

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Packaging Engineer vol. 28 #1 "Transparent bags foil static electricity's zap", Jan. 1983.

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