Surface package type semiconductor package

Details Surface package type semiconductor package Surface package type semiconductor package

1989-08-10

1990-11-20

Fidei, David T.

Special receptacle or package

For a building component

Shingle

206204, 206331, 428922, 361212, 361220, B65D 7302

Patent

active

049711962

ABSTRACT:
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

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