Surface mounting type electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

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Details

257694, 257695, 257696, 257666, 438123, H01L 23495, H01L 2348, H01L 2352

Patent

active

057239029

ABSTRACT:
A surface mounting type electronic component is provided which includes an electronic element enclosed in a resin package, and a plurality of leads electrically connected to the electronic element. Each of the leads has an inner lead portion inserted in the package and an outer lead portion extending out of the package. The outer lead portion has an end face includes a rounded bottom corner portion continuous with the flat bottom surface, a vertically scored lower portion following the rounded bottom corner portion, and a tear portion above the vertically scored portion.

REFERENCES:
patent: 4777520 (1988-10-01), Nambu et al.

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