Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1994-08-29
1996-04-16
Jackson, Jr., Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257787, 257730, H01L 2348, H01L 2352
Patent
active
055085571
ABSTRACT:
A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.
REFERENCES:
patent: 4777520 (1988-10-01), Nambu et al.
patent: 5023702 (1991-06-01), Micic et al.
patent: 5184211 (1993-02-01), Fox
patent: 5227662 (1993-07-01), Ohno et al.
Eilberg William H.
Jackson, Jr. Jerome
Kelley Nathan K.
Rohm & Co., Ltd.
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