Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2000-03-28
2001-06-12
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S050510, C174S255000, C174S259000, C174S261000, C174S262000, C310S311000, C310S348000, C310S365000, C361S301100, C361S760000, C361S807000
Reexamination Certificate
active
06246013
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a surface mounting structure and a surface mount type electronic component included in the surface mounting structure.
2. Description of Related Art
As an example of a conventional surface mount type electronic component, a piezoelectric component is known to be formed by sandwiching between two external substrates a piezoelectric substrate having an oscillation electrode disposed thereon. The external substrates define with the piezoelectric substrate an enclosed oscillation space and protects the piezoelectric substrate from mechanical stress.
In another type of known surface mounting type piezoelectric component, a piezoelectric substrate having an oscillation electrode disposed thereon is firmly attached to a base substrate, and a cover member is arranged to cover the piezoelectric substrate. The cover member defines with the base substrate an enclosed oscillation space and protects the piezoelectric substrate from external mechanical stress.
In the conventional surface mount type piezoelectric components, however, the piezoelectric resonator is covered, for example, with external substrates or a cover member having an enclosing function and other space defining functions, so that the height of the product is rather large. Thus, when this piezoelectric component is mounted on a printed circuit board or other substrate, the height of the entire device is rather high, so that it is not a surface mounting structure suitable for achieving a reduction in height. Further, since the thickness of the piezoelectric resonator differs depending on the specifications such as resonance frequency, it is difficult to achieve a uniform height dimension of such components.
SUMMARY OF THE INVENTION
To overcome the above described problems, preferred embodiments of the present invention provide a surface mounting structure suitable for achieving minimizing height and a surface mount type electronic component for use in the surface mounting structure.
One preferred embodiment of the present invention provides a surface mounting structure including a first substrate having an external connection electrode on a mounting surface thereof, an electronic component element mounted on the mounting surface of the first substrate and electrically connected to the external connection electrode, and a second substrate on which the first substrate is mounted and which is provided with a circuit pattern that is electrically connected to the external connection electrode, wherein the first substrate is secured to the second electrode and the external connection electrode of the first substrate is electrically connected to the circuit pattern of the second substrate, with the mounting surface of the first substrate being arranged on the second substrate side.
Examples of the materials and members used to secure the first substrate to the second substrate and to electrically connect the external connection electrode of the first substrate to the circuit pattern of the second substrate include an anisotropic conductor and a conductive adhesive. Other suitable materials and members can also be used.
As a result of the unique arrangement and construction described above, the second substrate achieves the enclosing function and the protecting function of the cover member of the surface mount type electronic component and a component of the covering substrate. Thus, it is possible to omit the cover member which is necessary in conventional components, thereby achieving a very significant reduction in the height of the entire surface mounting structure.
Further, by providing the first substrate with a recess for accommodating at least a portion of an electronic component element or by providing the second substrate with a recess, a through-hole, or such opening member, for accommodating at least a portion of an electronic component element, the visible and effective height of the electronic component element is reduced, and the height of the entire surface mounting structure is therefore greatly reduced.
Other features, elements, advantages and characteristics of the present invention will be described in more detail and will become apparent from the detailed description of preferred embodiments of the present invention and the attached drawings.
REFERENCES:
patent: 5162613 (1992-11-01), Schoenthaler
patent: 5400221 (1995-03-01), Kawaguchi
patent: 5768109 (1998-06-01), Gullick et al.
patent: 5780776 (1998-07-01), Noda
patent: 5880553 (1999-03-01), Okeshi et al.
patent: 5900790 (1999-05-01), Unami et al.
patent: 5901046 (1999-05-01), Ohta et al.
patent: 6002592 (1999-12-01), Nakamura et al.
patent: 6048433 (2000-04-01), Maesaka et al.
Amano Tsuneo
Yoshida Ryuhei
Gaffin Jeffrey
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
Patel I. B.
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