Metal fusion bonding – Process – Plural joints
Patent
1996-11-08
1997-11-25
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228175, 228189, 361768, H05K 334, H05K 100
Patent
active
056902700
ABSTRACT:
A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin. The pin is sized for loosely fitting within the feedthrough and thus movement caused by a coefficient of thermal expansion mismatch between materials of the pad, pin, and printed circuit board is absorbed by movement of the pin within the feedthrough. As a result, stress relief is provided for the solder joints.
REFERENCES:
patent: 3835531 (1974-09-01), Luttmer
patent: 5135890 (1992-08-01), Temple et al.
patent: 5163605 (1992-11-01), Mencik et al.
Heinrich Samuel M.
Sawtek Inc.
LandOfFree
Surface mounting stress relief device and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface mounting stress relief device and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mounting stress relief device and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2100062