Surface mounting semiconductor device and semiconductor mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

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Details

257735, 257783, H01L 2348, H01L 2352, H01L 2940, H01L 2312

Patent

active

057809313

ABSTRACT:
A surface mounting semiconductor device or a mounting component includes a metallic carbonate coating on a mounting surface which may be a plated layer of a metal easy to solder on which an outer lead or the like is to be mounted so that the oxidation of the mounting surface of the outer leads during storage is reliability prevented. Upon mounting the semiconductor device to the circuit board with solder, the heat added causes the metallic carbonate coating to decompose, to evolve CO.sub.3, and leave active metal, significantly improving solder wettability, so that a reliable solder joint is obtained. Since CO.sub.3 is evolved in the gaseous state, it does not stay on the metal surface, eliminating the need for cleaning after the treatment. Because solder wettability is significantly improved, molten solder cannot flow from the side of the soldered joint to bridge outer leads and terminals.

REFERENCES:
patent: 3665590 (1972-05-01), Percival
patent: 4711026 (1987-12-01), Swiggett et al.
patent: 4859807 (1989-08-01), Swiggett et al.
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5492235 (1996-02-01), Crafts et al.
patent: 5607609 (1997-03-01), Sakuyama et al.

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