Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-07-03
2007-07-03
Dang, Trung (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S112000, C438S123000, C257SE23031, C257SE23042, C257SE23043
Reexamination Certificate
active
11256553
ABSTRACT:
A semiconductor device X1comprises: a first conductor110including a first terminal surface113a; a second conductor120placed by the first conductor110and including a second terminal surface123afacing a same direction as does the first terminal surface113a; a third conductor130connected with the first conductor110; a semiconductor chip140including a first surface141and a second surface142away from the first surface, and bonded to the first conductor110and to the second conductor120via the second surface142; and a resin package150. The first surface141of the semiconductor chip140is provided with a first electrode electrically connected with the first conductor110via the third conductor130. The second surface142is provided with a second electrode electrically connected directly with the second conductor120. The resin package150seals the first conductor110, the second conductor120, the third conductor130and the semiconductor chip140while exposing the first terminal surface113aand the second terminal surface123a.
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Dang Trung
Hamre Schumann Mueller & Larson P.C.
Rohm & Co., Ltd.
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