Surface mounting semiconductor device and method

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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Details

357 74, 357 81, 361421, H01L 2348, H01L 2944, H01L 2952, H01L 2302

Patent

active

050757598

ABSTRACT:
A surface mounting device incorporating a high power RF semiconductor transistor comprises a common lead plane, an input lead plane, a collector lead plane, a transistor die electrically and thermally connected to the collector lead plane, bonding wires for connecting emitters and bases of the transistor to the common and input lead planes respectively, and a molded plastic body member for sealing the device components while leaving the lower coplanar surfaces of the lead planes exposed on the bottom face of the device. There are no flying leads. By eliminating an expensive metallized ceramic insulator from inside the device package and instead providing electrical isolation as a part of an external circuit board, the cost for fabricating the device and installing them on the printed circuit board are significantly reduced. The device is particularly rugged and can be easily mounted on the PC board by automated equipment.

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