Surface mounting pin grid arrays

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174260, 361791, 439 50, 439 83, 439 65, 439 79, H05K 114

Patent

active

054849640

ABSTRACT:
The present invention is a double headed pin for electrically interconnecting a PGA substrate carrier to a surface mount printed circuit board. The double headed pins provide for a stronger interconnection to the conductive pads on the surface mount printed circuit board. The increase in contact and soldering wetting area makes the interconnections stronger and more durable.

REFERENCES:
patent: 3924918 (1975-12-01), Friend
patent: 4295700 (1981-10-01), Sado
patent: 5324892 (1994-06-01), Granier et al.
patent: 5390078 (1995-02-01), Taylor

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