Surface mounting leadless components on conductor pattern suppor

Details Surface mounting leadless components on conductor pattern suppor Surface mounting leadless components on conductor pattern suppor

1988-11-28

1990-05-22

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428901, 156252, 156257, 206228, 206230, G32B 302

Patent

active

049276972

ABSTRACT:
Flux residue drawn by capillary action into the small gap between a conductor pattern support e.g. a printed circuit board, and a leadless electronic component surface mounted on the support is hard to remove and may corrode the conductor pattern. Herein the component is fixed to the support by a pad of adhesive elastomer so as to give a larger and hence more easily cleanable gap between component and support and the component connector pads are coupled to the conductor pattern by way of solder pillars formed by pre-loading the component connector pads and the pattern with precisely defined amounts of solder and, e.g. during a vapor phase re-flow, causing the pre-loads to merge and form the solder pillars.

REFERENCES:
patent: 4666545 (1987-05-01), DeGree et al.
patent: 4755249 (1988-07-01), DeGree et al.

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