Surface mounting device and its used support

Inductor devices – With mounting or supporting means

Reexamination Certificate

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C336S200000, C336S210000

Reexamination Certificate

active

06661323

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a surface mounting device and its used support; in particular, to a surface mounting inductor and its used support.
2. Description of the Related Art
Generally, conventional surface mounting inductors are divided into several types. Referring to
FIG. 1
a
and
FIG. 1
b
, a surface mounting inductor
10
without a support is shown. Such surface mounting inductor
10
is provided with an iron core
11
and a coil
12
. The coil
12
must be directly soldered to the bottom
111
, as shown in
FIG. 1
c
, of the iron core
11
.
When the surface mounting inductor
10
is mounted on a printed circuit board (not shown), it cannot be isolated from the printed circuit board. Thus, circuits on the printed circuit board cannot pass through the bottom
111
of the iron core
11
. As a result, the layout of the circuit requires additional space and the size of the whole printed circuit board increases.
Referring to
FIG. 2
a
,
FIG. 2
b
,
FIG. 3
a
and
FIG. 3
b
, other surface mounting inductors
20
,
30
are shown. The surface mounting inductor
20
is provided with an iron core
21
, a coil
22
and a support
23
, and the surface mounting inductor
30
is provided with an iron core
31
, a coil
32
and a support
33
. The support
23
is provided with a pin
231
, and the support
33
is provided with a pin
331
. The coil
22
winds around the pin
231
, and the coil
32
winds around the pin
331
.
Electrodes of the surface mounting inductors
20
,
30
are formed by L-shaped metal supports
23
,
33
glued to the bottom of the iron core
21
,
31
. Since the fabricating process of the surface mounting inductors
20
,
30
are simple, the manufacturing cost of the surface mounting inductors
20
,
30
is lower than that of the surface mounting inductor
10
. However, the surface mounting inductors
20
,
30
have the same disadvantage as the surface mounting inductor
10
. That is, when the surface mounting inductors
20
,
30
are mounted on the printed circuit board, they cannot be isolated from the printed circuit board.
Referring to
FIG. 4
a
and
FIG. 4
b
, another surface mounting inductor
40
is shown. The surface mounting inductor
40
is provided with an iron core
41
, a coil
42
, a support
43
, and two L-shaped metal parts
44
. The coil
42
is soldered to the support
43
. The L-shaped metal parts
44
are used as electrodes, and partially inserted into holes
45
of the support
43
.
Referring to
FIG. 5
a
and
FIG. 5
b
, another surface mounting inductor
50
is shown. The surface mounting inductor
50
is provided with an iron core
51
, a coil
52
, a support
53
, and two U-shaped metal parts
54
. The support
53
is provided with an upper surface
531
and a flat bottom surface (not shown). The upper surface
531
is provided with a concave portion
531
a
with the iron core
51
disposed thereupon. The U-shaped metal parts
54
are used as electrodes, and fit with the circumference of the support
53
. The coil
52
is soldered to the U-shaped metal parts
54
. When the surface mounting inductor
50
is mounted on the printed circuit board, the bottom surfaces of the U-shaped metal parts
54
are in contact with the printed circuit board.
The surface mounting inductors
40
,
50
have the following disadvantages:
1. Since the L-shaped metal parts
44
and the U-shaped metal parts
54
are disposed on the support
43
,
53
, the bottom surfaces of the supports
43
,
53
are uneven; and
2. Since the supports
43
,
53
are made of plastic, the strength of the supports
43
,
53
is insufficient and the supports
43
,
53
are easily damaged when the profile of the supports
43
,
53
is thin. In contrast, when the thickness of the supports
43
,
53
increases, the thickness of the whole surface mounting inductors
40
,
50
also increases.
SUMMARY OF THE INVENTION
In order to address the disadvantages of the aforementioned surface mounting inductor, the invention provides a surface mounting inductor with an isolation support.
Another purpose of this invention is to provide a support for a surface mounting device having an inductive device.
Accordingly, the invention provides a support for modifying an inductive device to a surface mounting device. The inductive device is provided with a core and a coil, and the support includes an electric portion and an isolation portion. The electric portion, having a first surface and a second surface opposite to the first surface, is electrically coupled to the coil. The first surface of the electric portion is in contact with the core. The isolation portion is disposed on the second surface of the electric portion in a manner such that the isolation portion covers one part of the second surface of the electric portion. The isolation portion is flush with the other part of the second surface of the electric portion.
In a preferred embodiment, the electric portion is a metal plate with an L-shaped cross-section.
In another preferred embodiment, the electric portion includes two metal plates respectively having an L-shaped cross-section.
Furthermore, the metal plates are integrally formed.
In another preferred embodiment, the electric portion is a metal plate with a U-shaped cross-section.
In another preferred embodiment, the electric portion is provided with a plurality of pins for the coil winding thereon.
Furthermore, each of the pins is provided with a notch for leading the coil.
In another preferred embodiment, the electric portion is glued to the core.
In another preferred embodiment, the isolation portion is a paint layer coating on the one part of the second surface of the electric portion.
In another preferred embodiment, the isolation portion is a plastic film glued to the one part of the second surface of the electric portion.
In another preferred embodiment, this invention provides a surface mounting device. It includes a core, a coil, an electric portion and an isolation portion. The coil winds around the core. The electric portion, having a first surface and a second surface opposite to the first surface, is electrically coupled to the coil. The first surface of the electric portion is in contact with the core. The isolation portion is disposed on the second surface of the electric portion in a manner such that the isolation portion covers one part of the second surface of the electric portion. The isolation portion is flush with the other part of the second surface of the electric portion.


REFERENCES:
patent: 6081180 (2000-06-01), Fernandez et al.
patent: 6285272 (2001-09-01), Boytor et al.
patent: 6292083 (2001-09-01), Tajima et al.
patent: 6359541 (2002-03-01), Watanabe
patent: 6504463 (2003-01-01), Kato et al.
patent: 5-121248 (1993-05-01), None
patent: 2000-269039 (2000-09-01), None

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