Surface mounted holes for printed circuit boards

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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Details

439874, 439876, H01R 909

Patent

active

056073135

ABSTRACT:
A method and device for improved assembly to hole-free PCBs of high aspect ratio components or any other components that are not easily assembled to a hole-free PCB by standard surface-mount technology (SMT), such as pins, lugs, tabs, and test points. A metal or other electrically conductive member having one or more holes ("holed component") is mounted to the PCB, typically on a solder pad on the PCB. The said electrically conductive member, will have a low aspect ratio. The hole, which may be round, rectangular, or threaded, is sized to provide an interference fit with the male projection of the component which will be inserted within the hole. The holed component, like other low aspect ratio SMT components, may be delivered on tape and reel and conventional surface mount or pick and place equipment is used to surface mount the holed component on the hole-free PCB, following which the holed component is soldered in place. Then, the male projections of the components can be press-fitted into the holes of one or more of such soldered holed components in the same manner as such components were previously interference fitted into the holes of PCBs, using high speed inserter machines.

REFERENCES:
patent: 3464051 (1969-08-01), Webb
patent: 4056302 (1977-11-01), Braun et al.
patent: 4645288 (1987-02-01), Stursa
patent: 5127838 (1992-07-01), Zaderej et al.

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