Surface mounted electronic device with selectively solderable le

Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor

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H01G 900

Patent

active

048149470

ABSTRACT:
A surface mounted device (SMD) having leads selectively solderable so that those portions of the leads extending down along the sides of the device body are not solderable. Thus, during attachment to a mother board by wave soldering, solder does not collect in the spaces between the leads and the device body, and both solder joint reliability and strength are improved.

REFERENCES:
patent: 2636920 (1953-04-01), Lockery et al.
patent: 3271625 (1966-09-01), Caracciolo
patent: 3948736 (1976-04-01), Russell
patent: 4539623 (1985-09-01), Irikura et al.
patent: 4590672 (1986-05-01), Shimizu et al.
patent: 4660127 (1987-04-01), Gunter
patent: 4672358 (1987-06-01), Pryst et al.

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