Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-01
2008-01-01
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S728000, C361S748000, C361S749000, C361S761000, C361S763000, C361S764000, C361S765000, C361S767000, C361S783000, C257S723000, C257S724000, C257S725000
Reexamination Certificate
active
07315455
ABSTRACT:
More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.
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Hassan Hashemi et al. “A Mixed Solder Grid Array and Peripheral Leaded MCM Package”,Proceedings of the Electronic Components and Technology ConferenceJun. 1-4, 1993,vol. CONF. 43, New York City.
Furukawa Osamu
Ikata Osamu
Murata Toshihiko
Arent & Fox LLP
Dinh Tuan T.
Fujitsu Media Devices Ltd.
Nguyen Hoa C
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