Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Patent
1998-09-18
2000-03-28
Stephan, Steven L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
439606, 439108, H01R 909
Patent
active
060423862
ABSTRACT:
A high speed, high density surface mount connector which may be easily manufactured. The connector is formed by injection molding a ground plate into a portion of an insulative housing, leaving conducting beam portions and tail portions extending from opposite ends of the housing. A mating section of the housing is separately made. Signal contacts are sandwiched between the two pieces of the housing, which are then mated. The signal contacts are parallel to the ground plate but spaced apart from it, forming individual transmission lines. In use, the tail portions are soldered to a printed circuit board. The beam portions are bent to form contact springs. They make contact to a back plane when the connector is pressed against the back plane.
REFERENCES:
patent: 4795374 (1989-01-01), Rishworth et al.
patent: 4904197 (1990-02-01), Cabourne
patent: 4909743 (1990-03-01), Johnson et al.
patent: 4932885 (1990-06-01), Scholz
patent: 5052936 (1991-10-01), Biechler et al.
patent: 5098311 (1992-03-01), Roath et al.
patent: 5127839 (1992-07-01), Korsunsky et al.
Cohen Thomas S.
Gailus Mark W.
Patel T C
Stephan Steven L.
Teradyne, Inc.
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