Coherent light generators – Particular temperature control – Heat sink
Reexamination Certificate
1997-05-09
2001-12-04
Leung, Quyen (Department: 2881)
Coherent light generators
Particular temperature control
Heat sink
C372S050121
Reexamination Certificate
active
06327285
ABSTRACT:
CROSS REFERENCES TO CO-PENDING APPLICATIONS
None.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention pertains to the field of high power semiconductor laser array packages, and more specifically provides a two-dimensional surface mounted diode laser array package configuration for high power laser output, which is efficient in operation.
2. Description of the Prior Art
Prior art diode laser packages required assembly from several parts made from different materials. In the present invention, the whole lower region of the surface mounted array package, upon which package laser diodes are mounted, is made from the same material and can be readily micro-machined, which facilitates; industrial production of the surface mounted 2-D diode laser array packages. The prior art high power diode laser packaging techniques mounted the diode laser bars on thin heat sink sheets and then stacked them together. These bar-stack packages have shortcomings compared to the surface-mount package, such as the difficulties for replacement of the dead or malfunctioning laser bars, difficulty for automatic manufacturing methods, requirement of high-reflectivity coating for the laser diodes, and ineffective heat removal.
The present invention overcomes the problems found in prior art devices and is intended for use in packaging high power semiconductor lasers in order to solve the current problems encountered by most of the current construction techniques. The two-dimensional semiconductor laser array package significantly reduces the distance between the hot spots of the laser diode and the heat sink, so that the heat generated in the laser diodes can be removed more efficiently. Since the mirrors and laser mounting stages can be made from the same material as the broad area heat sink, the whole package can be simply manufactured by conventional automated micro-machining technique. The diode lasers are mounted on the open surface of the package and between the angled mirrors, so they can be accessed easily for automated manufacturing and replacement of damaged lasers.
SUMMARY OF THE INVENTION
The general purpose of the present invention is to provide a surface-mount construction for packaging high power diode laser bars.
According to one embodiment of the present invention, there is provided a surface mounted 2-D diode laser array package comprised of a one-piece integral member including a heat sink and a group of parallel flat mounting stages separated by V-shaped angled mirrors with flat or parabolic reflecting surfaces, and laser diodes suitably attached to the mounting stages. The mounting stages have the same width as the laser diode bars and are slightly higher than the bottoms of the angled mirrors in order to deflect the laser light efficiently. Ceramic standoffs align adjacent to the ends of the laser diodes and the angled mirrors to provide for connection to the laser diodes. High power diode laser bars are surface mounted on the stages to allow for maximum heat removal. Laser light emitted equally from opposing facets of the laser bars is deflected into free space by the angled mirrors and then collected by external optics.
One significant aspect and feature of the present invention is a one-piece multifunctional integral array member including laser bar mounting stages, deflection mirrors, and a broad area heat sink, all integrated and made from the same material, for example OFHC copper (Oxygen Free High Conductivity) or silicon, or other suitable thermally conductive material, significantly reducing the fabrication cost of the packages.
Another significant aspect and feature of the present invention is that the material could be any material that is thermally conductive and, thus, is not limited to OFHC and Si.
Yet another significant aspect and feature of the present invention features diode laser mounting stages which are made from the same material as the heat sink and which are integral with the heat sink, so that the heat generated in the laser can be removed very efficiently by an external heat exchanger.
Still another significant aspect and feature of the present invention is the provision of low profile wire-bonding in order to connect the laser diodes to a laser driver without blocking the laser emission.
An additional significant aspect and feature of the present invention is that any type of high power diode lasers can be mounted as a member of this invented package.
A further significant aspect and feature of the present invention is that the surfaces of the deflection mirrors can be flat, parabolic, or other curved or configured shapes.
Having thus described embodiments of the present invention, it is the principal object of the present invention to provide a surface mounted 2-D diode laser array package which provides for the dispersion of heat from and dispersion of laser energy from diode laser bars.
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Mayer et al, Electronic Materials Science: For Integrated Circuits in Si and GaAs, New York: MacMillan Publishing Company, 1990, pp. 44-46. (No month available).*
IBM Technical Disclosure Bulletin, “Monolithic Laser Arrays with Single-Lobed Farfield”, vol. 38, No. 7, pp. 349-350, Jul. 1995.
Jaeger Hugh D.
Leung Quyen
Semiconductor Laser International Corporation
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