Surface mountable transducer system

Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C381S173000, C367S181000

Reexamination Certificate

active

10323757

ABSTRACT:
The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

REFERENCES:
patent: 4225755 (1980-09-01), Block
patent: 4533795 (1985-08-01), Baumhauer, Jr. et al.
patent: 4885781 (1989-12-01), Seidel
patent: 4908805 (1990-03-01), Sprenkels et al.
patent: 5146435 (1992-09-01), Bernstein
patent: 5265470 (1993-11-01), Kaiser et al.
patent: 5272758 (1993-12-01), Isogami et al.
patent: 5452268 (1995-09-01), Bernstein
patent: 5490220 (1996-02-01), Loeppert
patent: 5856914 (1999-01-01), O'Boyle
patent: 5870482 (1999-02-01), Loeppert et al.
patent: 5889872 (1999-03-01), Sooriakumar et al.
patent: 6009753 (2000-01-01), Tsang et al.
patent: 6088463 (2000-07-01), Rombach et al.
patent: 0561566 (1993-09-01), None
“The first silicon-based micro-microphone” Elektronik og Data, No. 3, pp. n 4-8, 1998.
Jeffrey T. Butler et al., “Multichip module packaging of microelectromechanical systems, Sensors and Actuators”, A 70 (1998), pp. 15-22.
K.W. Markus et al., “Smart Mems: Flip Chip Integration of mems and Electronics,” SPIE, vol. 2448, pp. 82-92.
F. Mayer et al., “Flip-Chip Packaging for Smart MEMS”, SPIE, vol. 3228, pp. 183-193.
Michael M. Maharbiz et al., “Batch Micropackaging by Compression-Bonded Wafer-Wafer Transfer”.
T. Gebner et al., “Bonding and Metallization for a High Precision Acceleration Sensor”, Electochemical Society Proceedings, vol. 95-27, pp. 297-308.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Surface mountable transducer system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface mountable transducer system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mountable transducer system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3753651

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.