Surface mountable semiconductor package with solder bonding...

Details Surface mountable semiconductor package with solder bonding... Surface mountable semiconductor package with solder bonding...

2007-09-05

2010-06-15

Geyer, Scott B (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S779000, C257SE23048, C257SE21506, C257SE21509, C438S123000

Reexamination Certificate

active

07737546

ABSTRACT:
A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

REFERENCES:
patent: 4209358 (1980-06-01), DiLeo et al.
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patent: 5041901 (1991-08-01), Kitano et al.
patent: 5367124 (1994-11-01), Hoffman et al.
patent: 5455446 (1995-10-01), Suppelsa et al.
patent: 6300678 (2001-10-01), Suehiro et al.
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patent: 2-109356 (1988-10-01), None
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patent: 6-37441 (1994-02-01), None
patent: 10-41192 (1998-02-01), None
Machine Translation of JP 10-41192, Rohm Co., Ltd., Feb. 1998.

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